Simulated intelligence Innovation has over 29 years experience in planning and assembling different types of superior execution “Tranquil” adaptable glue movies and glues and materials for microelectronic bundling and warm connection point materials for warm administration applications.
Our most current examination has yielded better execution and lower cost, solderable adaptable circuit substrate materials to supplant polyimide-based natural copper-clad covers in high recurrence, RFID, and with low dielectric consistent misfortune and low dampness retention in supplanting PTFE substrate material in microwave circuits.
Our advancements and items incorporate dissolvable free kicks the bucket and substrate connect glues and movies, compressible hole filling stage change warm point of interaction materials of warm cushions, warm gels, warm lubes, polymer based Patch Sub® adaptable conductive cements for weld substitution in fine-pitch interconnections,
close airtight top sealant for artistic and metal covers and optical glass tops for opto-electronic sensors and gadgets, EMI Safeguarding gasket/glue/caulk materials, twofold sided UV-discharge wafer crushing tapes and high temperature-static free dicing tapes.
OUR Set of experiences
Since spearheading the utilization of adaptable epoxy innovation for microelectronic bundling in 1985, simulated intelligence Innovation has been one of the main powers being developed and protected uses of cutting edge materials and cement answers for electronic interconnection and bundling.
Simulated intelligence Innovation presently has one of the greatest unwavering quality glues and underfills for bite the dust holding for the biggest kicks the bucket, stack-chip bundling with dicing pass on connect film (DDAF), flip-chip holding and underfilling and high temperature bite the dust holding for single and various chip modules for applications past 230°C.
The organization keeps on giving the cement answer for part and substrate holding for both military and business applications.
Its warm connection point material arrangements of licensed stage change warm cushions, warm lubes and gels and warm glues set many seat characteristics of execution and dependability for power semiconductors, modules, PCs and correspondence gadgets.
The organization has an ISO9001:2008 affirmed producing and Research and development office in the U.S. furthermore, a Far East Help Community in Hong Kong. The US base camp has in excess of 50,000 square feet of assembling offices for its kick the bucket and substrate joined cement movies and glues,
warm connection point materials (TIM) including protected metal substrates, hole filling compressible stage change cushions, warm gels, warm lubes and cement movies and glues.
Man-made intelligence Innovation gives electromagnetic and radio recurrence impedance (EMI/RFI) moderation material arrangements including conductive gaskets, structure set up (FIP) conductive gaskets, self-connected safeguarding covers/jars/tops, conductive caulks and cements,
super high temperature (300°C) consistent use movies and glue kick the bucket and part glues and high level natural copper-clad overlays from 1/4 oz to 1 oz copper inside its 16-section of land grounds in Princeton Intersection, NJ.
AIT application designing, deals, physicists, and material researchers are prepared to serve your custom necessities. Kindly advise us regarding your necessities utilizing the Contact tab or snap on the button beneath:
Table of contents: Top 10 Artificial Intelligence Technologies
- Natural language generation
- Speech recognition
- Virtual agents
- Decision management
- Biometrics
- Machine learning
- Robotic process automation
- Peer-to-peer network
- Deep learning platforms
- AL-optimized hardware
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